Applications

Neurodevices

Brain-adjacent compute has a different rulebook: heat isn’t “annoying,” it’s unacceptable. Reduce switching power to keep implants cool while maintaining capability.

≤2°C
Thermal rise tolerance (implant context)
Ultra-Low
Power is the primary design constraint
10×+
Dynamic switching power reduction (target)

The challenge

Neural implants and brain-interface devices cannot tolerate heat buildup. Even small temperature rises can be harmful, which forces most systems into severe power and performance compromises.

LPP focuses on reducing switching losses so heat generation drops at the source, enabling safer compute near sensitive tissue.

Where efficiency matters most

Always-On Sensing

Continuous sampling and preprocessing under strict thermal ceilings.

Signal Processing

Real-time filtering, compression, and feature extraction under power caps.

On-Chip Memory

Local storage and buffering without costly power spikes.

What you can evaluate first

Identify the highest-toggle blocks (arrays/clocking) and validate measurable reductions under implant-relevant workloads.

Outcome

Lower heat, better safety margins, and more headroom for algorithms that improve signal quality and device capability—without pushing thermal limits.