Break the energy wall. Reduce dynamic switching power by over 10× without compromising performance, and cut the cooling + energy cost spiral that’s limiting AI growth.
AI and cloud workloads are accelerating faster than energy production growth. The result is escalating operating cost, higher rack-level thermal density, and a growing capex burden for power delivery + cooling.
The core inefficiency is fundamental: modern microprocessors waste the majority of energy as heat. LPP reshapes switching so energy stays in the circuit and is reused on the next cycle—rather than dumped.
High toggle-rate distribution networks where “wasted switching” becomes an always-on heater.
Large array structures where power scales brutally with activity and bandwidth.
Programmable fabrics with heavy switching and thermal constraints.
Choose the approach that matches your roadmap and risk profile.
A functional-compatible chip built with LPP for immediate evaluation and sampling.
Use LPP compilers (SRAM / FPGA) to build your own SoCs, ASICs, or eFPGAs.
Process-node agnostic and designed to avoid foundry modifications.
Lower dynamic power reduces thermal throttling, increases safe operating margin, and helps you trade watts for throughput, not watts for heat. That cascades into lower cooling cost, higher rack utilization, and better sustainability metrics.
